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The software CTO at eSOL will make a speech at COOL Chips XVII—IEEE Symposium on Low-Power and High Speed Chips


Masaki Gondo, Software CTO at eSOL and Multicore Association SHIM Working Group chair, will make a speech at the COOL Chips XVII on the SHIM standard that provides a common software-hardware interface between the multicore processor hardware and the software tools. The SHIM standard has been defined by Multicore Association SHIM Working Group to enable developers of software development tools and runtime software to reduce their processor support costs and accelerate products’ time to market.

COOL Chips is an international IEEE symposium initiated in 1998 to present advancement of low-power
and high-speed chips. The COOL Chips XVII is to be held in Yokohama on April 14-16, 2014.

For registration, please visit the COOL Chips XVII official site.

[Speech information]
Date and Time: Tuesday, April 15, 2014, 3:30pm-4:20pm
Title:  [Session VI: Multi/Many Core] Establishing a standard interface between multi-manycore and software tools – SHIM
Speaker: Masaki Gondo, Software CTO and GM Technology Headquarters at eSOL and Multicore Association SHIM Working Group chair

* For more details, visit the COOL Chips XVII official site.